Use case 2 – Electronics assembly
OSAI S.A. assembles electronic and semiconductor products. Automation of the assembly process could decrease the size of the assembly station and guarantee a high product quality, which would also reduce waste. However, the components are small and fragile and need to be handled with care. Intelligent multisensory systems will allow the robot to handle different products in parallel without needing to be reprogrammed.
The components are small, fragile, and many of them look alike. Yet, to manufacture different parts in parallel, it is crucial that the individual components are identified quickly and reliably. Automating this process will not only increase the throughput but also reduce contamination and ensure consistent high quality of the products.
The components range in size from 30x30mm to 70x70mm. After automatic component recognition, the dexterous and adaptable manipulator needs to grasp the small, deformable, fragile component securely, potentially re-orient it, and then move it precisely to a different location for assembly.
Below, find a rendering of how the future setup may look.
